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Proposal of a Biobased and Biodegradable Polymer as a Hot Embossing Substrate for Holographic Security Marks Fabrication
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Researchers demonstrated for the first time that poly(lactic acid) (PLA) can replace petroleum-based polymers as a substrate for hot-embossed holographic security marks, showing it can be recycled up to six times before composting without significant property loss.
ABSTRACT The alarming increase in counterfeiting has determined a more intensive application of authentication solutions such as holographic security marks. Polycarbonate or polymethyl methacrylate currently used in the hot embossing process to produce security marks are discarded as non‐biodegradable waste after utilization. For the first time, poly(lactic acid) (PLA) was studied here as a hot‐embossing substrate to imprint a micro‐relief containing diffractive gratings, as a stage in the fabrication of holographic security marks. Four PLA grades, which differ by crystallinity and mechanical properties, were used to define the suitability of PLA for hot embossing. The 3D topography of embossed micro‐relief in PLA plates was investigated by quantitative phase imaging, scanning electron microscopy, and atomic force microscopy (AFM). The analyses showed that a high crystallinity and a low d ‐lactide content of PLA render the hot‐embossing process more difficult and decrease the quality of the imprinted micro‐relief. The average height of the micro‐relief and the difference in height values, which were determined by AFM, allowed the ranking of the PLA grades according to the quality of the diffracted image. The possibility of recycling the embossed PLA substrate several times before composting was also demonstrated in this work. The variation of the mechanical properties, thermal stability, melting, and crystallization behaviors after each recycling cycle has shown that PLA can be reprocessed six times without significant damage to the properties. This study demonstrated that PLA can replace petroleum‐based polymers in the fabrication of holographic security marks and its suitability for a plethora of optoelectronics applications.
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