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Preparation and High‐Temperature Microplastic Forming Performance of Nano‐FeCoNi Medium‐Entropy Alloy Foils

Advanced Engineering Materials 2025 3 citations ? Citation count from OpenAlex, updated daily. May differ slightly from the publisher's own count.
You Li, Peike Wang, Yuxin Zhai, Jian Lv, Yuning Sun

Summary

Researchers fabricated nanocrystalline FeCoNi medium-entropy alloy foils using alternating current pulse electrodeposition and characterized their microstructure, crystallographic properties, and mechanical performance. A 45 µm foil was produced and subjected to high-temperature microbulging tests, demonstrating its potential for precision microforming applications at elevated temperatures.

Nanocrystalline FeCoNi medium‐entropy alloys (MEAs), characterized by their unique internal microstructure and substantial industrial application potential, often exhibit superior performance compared to conventional alloys and high‐entropy alloys. Herein, nanocrystalline FeCoNi MEAs are fabricated using an alternating current pulse electrodeposition method. The microstructure, crystallographic characteristics, and mechanical properties of the electrodeposited layers are systematically investigated. A MEA foil with a nanoscale grain thickness of 45 μm is successfully prepared. Furthermore, the foil is subjected to microbulging tests using a gas‐pressure microforming setup. The morphology and stress distribution of the deformed alloy are analyzed in detail.

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