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Studies on microplastic working. (One-shot piercing of many fine holes by VM process).
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A viscoplastic pressure medium process was evaluated for one-shot piercing of multiple fine holes in copper foil, targeting high-volume electronics manufacturing applications. The study characterized the quality of holes produced and the effect of process parameters on dimensional accuracy and edge quality.
Recent developments in the electronics industries a piercing technique for many fine holes at a high production rate. The present research attempts to apply to such piercing a manufacturing process using a viscoplastic pressure medium process (VM Process) previously proposed by one of the authors. The appearance of the holes pierced through copper foils is observed microscopically, and the effect of the working conditions on it is examined. Although only for a specific condition, the process is shown to be successful in piercing the circular holes of 50 μm in diameter with 75 μm in pitch, unobtainable by the conventional shearing process. Besides, a new technique (AFM method) for precise piercing applicable to general working conditions is proposed.
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Research digests by email
When a large batch of papers lands in the Atlas, we read through it and send a short write-up of what stood out.