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Direct evidence for microplastic fracture in single-crystal silicon at ambient temperature
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High-resolution transmission electron microscopy was used to directly image a microcrack in silicon induced by Vickers indentation at room temperature, revealing two dislocations at the crack tip and atomic-scale steps on the crack surface. This is direct evidence that crack propagation in silicon involves localized plastic deformation, not purely brittle cleavage, at the crack tip.
A high-resolution transmission electron microscopy image of a microcrack in single-crystal silicon induced by Vickers indentation at ambient temperature is presented. Two 60o dislocations can be clearly seen at the crack tip. The surface of the crack shows a step structure. This microplastic crack is compared with an atomically sharp crack.
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Structure-Sensitive Properties of Materials Disclosed by a Combination of X-Ray Topography X-Ray Diffraction Analysis, and Electron Microscopy Methods
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This paper describes a combined suite of X-ray topography, diffraction analysis, and electron microscopy methods developed to establish correlations between lattice defects and structure-sensitive material properties. Applications included analysis of deformation in beryllium, germanium, and silicon crystals, and characterization of microplastic and elastic strain distributions around propagating cracks.
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