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Study on Solidification Process and Residual Stress of SiCp/Al Composites in EDM

Micromachines 2022 6 citations ? Citation count from OpenAlex, updated daily. May differ slightly from the publisher's own count. Score: 30 ? 0–100 AI score estimating relevance to the microplastics field. Papers below 30 are filtered from public browse.
Wenchao Zhang, Hao Chang, Hao Chang, Yu Liu

Summary

A computational model of the heating and solidification process in electrical discharge machining of silicon carbide reinforced aluminum composites was developed to analyze residual stress formation. The model linked process parameters to thermal history and resulting stress distributions in the material. Better understanding of residual stress helps optimize cutting conditions to minimize material damage.

To study the change of residual stress during heating and solidification of SiCp/Al composites, a one-way FSI (Fluid Structure Interaction) model for the solidification process of the molten material is presented. The model used process parameters to obtain the temperature distribution, liquid and solid-state material transformation, and residual stress. The crack initiated by the thermal stress in the recast layer was investigated, and a mathematical model of crack tip stress was proposed. The results showed a wide range of residual stresses from 44 MPa to 404 MPa. The model is validated using experimental data with three points on the surface layer.

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