0
Article ? AI-assigned paper type based on the abstract. Classification may not be perfect — flag errors using the feedback button. Tier 2 ? Original research — experimental, observational, or case-control study. Direct primary evidence. Sign in to save

Molecular dynamics simulation of nanocrack closure mechanism and interface behaviors of polycrystalline austenitic steel

Frontiers in Materials 2022 1 citation ? Citation count from OpenAlex, updated daily. May differ slightly from the publisher's own count. Score: 25 ? 0–100 AI score estimating relevance to the microplastics field. Papers below 30 are filtered from public browse.
Huiqin Chen, Sizhe He, Juan Chen, Fei Chen, Sairu Zhang, Yingfan Zhang

Summary

This molecular dynamics simulation study investigated nanocrack closure and healing mechanisms in polycrystalline FeCrNi austenitic steel under compressive and shear loading conditions relevant to heavy forging applications. Under compressive loading, crack closure occurred through dislocation-dominant plastic deformation, while shear loading caused cracks to expand along grain boundaries through additional mechanisms including grain boundary slip, grain rotation, and twinning. Healed interface samples exhibited higher Young's modulus and yield strength than cracked samples regardless of loading conditions.

Void-type defects in heavy forgings deteriorate their mechanical properties and service life. In this work, the evolutions of a pre-crack closure and the healing and mechanical properties of FeCrNi polycrystalline samples are assessed under different loading conditions using molecular dynamics simulation. The stress–strain curves show that the sample with interface exhibits higher Young’s modulus and yield strength than those with cracks, despite the loading conditions. These results imply that samples under compression loading have a higher ability to resist plasticity, while the shear stress facilitates plastic flow. Crack closure and healing occur under compression stress by dislocation-dominant plastic deformation, while the crack length shrinks and the crack tips expand along grain boundaries (GBs) and the interface because of its higher stress under shear loading. Dislocation activities, including dislocation emission, slip, and interactions with cracks, grain boundaries, and dislocations, contribute to the plasticity of the specimen under compressive loading. In addition to dislocation activities, grain boundary slip, grain rotation, and twinning are potential plastic-deformation mechanisms under shear loading.

Sign in to start a discussion.

More Papers Like This

Article Tier 2

Stability of retained austenite in high carbon steel under compressive stress: an investigation from macro to nano scale

This materials science study investigates how retained austenite in high-carbon steel behaves under compressive stress at both macro and nano scales, using electron microscopy and diffraction techniques. The research addresses industrial steel performance and has no direct connection to microplastics or environmental health.

Article Tier 2

Crack nucleation using combined crystal plasticity modelling, high-resolution digital image correlation and high-resolution electron backscatter diffraction in a superalloy containing non-metallic inclusions under fatigue

This materials engineering study combined crystal plasticity modeling with high-resolution microscopy to understand how fatigue cracks form near non-metallic inclusions in nickel superalloys. The research addresses durability of industrial alloy components and is not related to microplastics research.

Article Tier 2

Role of Grain Boundary Sliding in Texture Evolution for Nanoplasticity

This materials science paper presents a crystal plasticity model for how grain boundary sliding affects texture evolution in nanocrystalline metals under large deformation. It is a technical metallurgy study with no connection to microplastics or environmental health.

Article Tier 2

Using Molecular Dynamic Simulation to Understand the Deformation Mechanism in Cu, Ni, and Equimolar Cu-Ni Polycrystalline Alloys

Researchers used molecular dynamics simulations to compare deformation mechanisms in copper, nickel, and equimolar copper-nickel alloy, finding that the alloy develops the highest density of Shockley dislocations and stacking faults — producing a distinct gliding stage in its stress-strain curve — while grain boundaries act as dislocation sinks differently across the three materials.

Article Tier 2

Dislocation Arrangements and Cyclic Microplasticity Surrounding Stress Concentration in a Ni‐Based Single‐Crystal Superalloy

Not relevant to microplastics — this materials science study examines dislocation behavior and fatigue crack initiation in nickel-based single-crystal superalloys; 'microplasticity' here refers to microscale metal deformation, not plastic particles.

Share this paper