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Residual Stress Modeling Strategies for Mitigation and Stress-Relieving Processes

ASM International eBooks 2026
David Furrer, Vasisht Venkatesh, Dennis J. Buchanan

Summary

This paper isn't actually about human health or the microplastics that end up in our food and water — it's an engineering review about "microplasticity," a materials science term describing tiny, localized deformations in metal parts (like turbine disks) that engineers use to relieve built-up internal stresses. It summarizes computer modeling methods that help manufacturers make metal components safer and more durable by predicting how heat treatment or mechanical processing can reduce stress that might otherwise cause cracks or failures. While not relevant to microplastic pollution or personal health, it matters for the safety of things like aircraft parts and industrial equipment we rely on

Abstract This article centers on processes used to reduce residual stresses in manufactured components and structures, including thermal relaxation, microplastic relaxation, and microplastic relaxation under cyclic conditions. These processes fit into two primary means to relieve residual stresses: thermal processing to enable local plasticity and creep mechanisms, and mechanical processing to enable local or global yielding. Computational modeling can be used with each of these mechanisms to assess how effective they are at reducing residual stresses. It describes a progression of different creep models and solution procedures, from a simple analytic model with a closed-form solution to a complex displacement-based finite-element numerical solution that is capable of incorporating both material and geometric nonlinearities. The article discusses the implementation of creep data and models for stress-relief simulation. It describes more advanced techniques, beyond the simplified approaches for approximate solutions, that are applicable to transient creep, advanced constitutive models, and complicated stress and temperature loading histories. An example highlights the difference between a steady-state and transient creep analysis solution using a spinning disk that creeps at elevated temperature. The article also presents an overview of mechanical stress-relief modeling.

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